TSMC and Samsung plan to introduce new ASML EUV systems
In Taiwan, the Taipei Times reports that TSMC plans to use ASML high-numerical-aperture systems for mass chip production starting in 2030. Samsung Electronics intends to begin using such equipment to produce computer memory by 2028. Intel has already received the relevant machines.
These are high-numerical-aperture extreme ultraviolet lithography systems. The cost of one such installation can reach US$400 million. TSMC produces specialized chips for companies such as Nvidia and Apple, while Samsung is a leading manufacturer of memory chips.
Transition to larger photomasks
ASML, TSMC, Samsung and Intel have also agreed to switch from standard 6-inch photomasks to 12-inch ones. Photomasks are a key component of semiconductor manufacturing: they are used to transfer circuit images with light onto silicon wafers.
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The companies expect that the larger photomask format will help increase productivity and reduce costs amid growing demand for more powerful artificial intelligence technologies. ASML Chief Technology Officer Marco Pieters said that the new technology could increase the throughput of high-numerical-aperture systems by 40% and simplify the design process.
Technology implementation schedule
TSMC will initially use ASML systems with the current 6-inch photomasks. The company and ASML plan to create a test line for producing 12-inch masks by 2031 and to use this technology in production with high-numerical-aperture equipment by 2033.
Samsung said it would work with industry partners on photomask technologies and the necessary infrastructure. Intel said it can already offer the benefits of the new technology to potential customers and has been involved in the transition to larger photomasks for more than three years.
